Electronic Packaging: Design, Materials, Process, and Reliability

Electronic Packaging: Design, Materials, Process, and Reliability

  • Format:
  • EN
  • Source: yahoo.com

This book was shared by namir78 on misc category

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Smart Electronic Materials: Fundamentals and Applications

PublisherCambridge University PressPublish Year2005Pages / Duration432LanguageEnglishPosted bygorillaFile TypePDFUpload DateNovember 7, 2012CategoriesOthersSmart materials respond rapidly to external stimuli to alter their physical properties. They are used in devices that are driving advances in modern information technology and have applications in electronics, optoelectronics, sensors, memories and other areas. This book fully explains the physical properties of these materials, including semiconductors, dielectrics, ferroelectrics, ferromagnetics and organic polymers. Fundamental concepts are consistently connected to their real-world applications. It covers structural issues, electronic properties, transport properties, polarization-related properties and magnetic properties of a wide range of smart materials. The book contains carefully chosen worked examples to convey important concepts and has many end-of-chapter problems. It is written for first year graduate students in electrical engineering, materials science or applied physics programs. It is also an

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Materials and Design, Second Edition: The Art and Science of Material Selection in Product Design

  • Auhtor Michael F. Ashby, Kara Johnson
  • Category: Uncategorized
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  • ISBN

PublisherButterworth-heinemannPublish Year2009Pages / Duration344LanguageEnglishPosted byackmardFile TypePDFUpload DateNovember 6, 2012CategoriesOthersMaterials are the stuff of design. From the very beginning of human history, materials have been taken from the natural world and shaped, modified, and adapted for everything from primitive tools to modern electronics. This renowned book by noted materials engineering author Mike Ashby and Industrial designer, Kara Johnson, explores the role of materials and materials processing in product design, with a particular emphasis on creating both desired aesthetics and functionality. The new edition will feature even more of the highly useful "materials profiles," that give critical design, processing, performance and applications criteria for each material in question. The reader will find information ranging from the generic and commercial names of each material, its physical and mechanical properties, its chemical properties, its common uses, how it is typically made and processed, and even its average price. And with

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Current and Future Needs for Polymeric Materials

  • Format:
  • EN
  • Source: thor.inemi.org

Electronic Packaging Evolution ... • Increased I/O density for reduced pitch w/ materials, design and manufacturing processes Packaging technology to ... • New material systems and designs to enable high quality and reliability. Embedded components . 22 Long Term (>5 years) Strategic Gaps Time

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AN ADVANCED PACKAGING TECHNOLOGY FOR - OZER Advanced Technologies

  • Format:
  • EN
  • Source: metallicfoams.com

provide a power electronic module packaging technology, ... manufacturability, cost and reliability factors have been incorporated early in the design. The ... Materials," Electronics Cooling, Vol. 2, No. 3, pp. 12 -16. Title:

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DEVELOPMENT OF A KNOWLEDGE MODEL FOR THE COMPUTER-AIDED ...

  • Format:
  • EN
  • Source: smartech.gatech.edu

DEVELOPMENT OF A KNOWLEDGE MODEL FOR THE COMPUTER-AIDED DESIGN FOR RELIABILITY OF ELECTRONIC PACKAGING SYSTEMS Approved by: Dr. Suresh K. Sitaraman, Co-Advisor

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Microelectronics Overview Materials Issues in Area-Array ...

  • Format:
  • EN
  • Source: iweb.tms.org

22 JOM • March 1999 Overview Microelectronics The important issues in advanced area-array electronic packaging for semiconduc-tor devices are materials driven.

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PA&E Electronic Packages for Extreme Environments

  • Format:
  • EN
  • Source: pacaero.com

integrity, reliability, and rework-ability than conventional soldered packages. 8 ... materials including aluminum, titanium and iron-nickel alloys. ... electronic packaging and assemblies. > Metal-to-Ceramic Bonding

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Modeling and Simulation of Reliability in Electronic ...

  • Format:
  • EN
  • Source: eptc.elite.sg

Modeling and Simulation of Reliability in Electronic Packaging: Semiconductor Device and Board-Level Mechanisms Craig HILLMAN DfR Solutions Abstract

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More Than Moore: TSV, 3D, LTB, EWLP, MEMS and Photonic ...

  • Format:
  • EN
  • Source: ewh.ieee.org

packaging: Solder Joint Reliability; Handbook of Tape Automated Bonding; Thermal Stress and Strain in ... and Fine Pitch SMT Assemblies; Electronics Packaging: Design, Materials, Process, and Reliability; Chip Scale Package: Design, Materials, Process, Reliability, and Applications; Low

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course descriptions - ECTC | IEEE Electronic Components and ...

  • Format:
  • EN
  • Source: ectc.net

quality and reliability assessment and leverages mechanics to proactively assess the impact of geometry and material choices. The course ... integrity and electromagnetic interference effects in different packaging materials.

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Laboratory for Interconnecting and Packaging Electronic Circuits

  • Format:
  • EN
  • Source: lipec.info

and packaging electronic circuits (assemblies, materials, prototyping methods) ... „Tin-lead alloy in electronics packaging has to be ... Development, characterization and reliability of high performance nano

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Semiconductor Packaging Assembly Technology

  • Format:
  • EN
  • Source: focus.ti.com

Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in

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